Vacuum hot pressing machine is a device suitable for high-temperature, medium temperature, and low-temperature pressing of new materials under vacuum state. This product is mainly used in the vacuum hot pressing process of new materials such as graphite bipolar plates, composite materials, carbon fiber materials, carbon fiber phone cases, glass fiber flat cases, graphene materials, etc.
Advantages and Features
The vacuum hot press forming machine adopts servo system control, with stable pressure, high efficiency, high yield, flexible pressurization, fast vacuum, slow multi-stage pressurization, multi-stage heating, and the overall temperature difference can be controlled within ± 2 degrees. It has the characteristics of multi-stage pressure and multi-stage stroke, especially suitable for scenarios that require adjusting the process at any time. Fast vacuum, multi-stage pressure, slow pressurization, servo control, flexible pressurization. High precision, pressure control, flexible pressurization, fast vacuum, slow multi-stage pressurization.
| Item | TSPC -30T | TSPC -50T | TSPC -100T | TSPC -150T | TSPC -200T | TSPC -300T | TSPC -500T | TSPC -2000T |
| Mold closing force kN | 300 | 500 | 1000 | 1500 | 2000 | 3000 | 5000 | 20000 |
| Hot plate spacing mm | 300 | 300 | 300 | 300 | 400 | 1000 | 1000 | 1100 |
| Master Cylinder Stroke mm | 300 | 300 | 300 | 300 | 400 | 1100 | 1100 | 1100 |
| Hot Plate Area mm | 300*300 500*500 | 300*300 500*500 | 400*400 500*500 | 400*400 500*500 | 500*500 600*600 | 600*600 2000*2000 | 800*800 2000*2000 | 1000*1000 3000*2000 |
| Hot plate Tem °C | 100-500 | 100-500 | 100-500 | 100-500 | 100-500 | 100-500 | 100-500 | 1-550 |
| Parallelism mm | 0.03 | 0.03 | 0.03 | 0.03 | 0.04 | 0.04 | 0.04 | 0.05 |
| Flatness mm | 0.02 | 0.02 | 0.02 | 0.02 | 0.02 | 0.02 | 0.02 | ±0.03 |
| vacuum degreeMPa | -0.098 | -0.098 | -0.098 | -0.098 | -0.098 | -0.098 | -0.098 | -0.096 |
CUSTOMIZED PRODUCTS
We offer customized cellulose ether solutions to match your specific application, viscosity, setting time, and performance requirements.
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