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Fuel Cell Dispensing Equipment

This fuel cell dispensing equipment is specifically designed for precision sealing, frame bonding, and micro-hole filling processes for fuel cell anode/cathode plates (bipolar plates) and membrane electrode assemblies (MEAs).

Using automated dispensing technology, it forms high-precision, highly consistent sealing beads on the edges of the plate flow channels or on the MEA frame, preventing cross-leakage of hydrogen, oxygen, and coolant.


Core Components & Functional Modules


1. High‑Precision Motion Platform

H‑type dual‑drive gantry structure with high‑rigidity beam, linear motor/servo dual drive, and full‑closed‑loop grating ruler feedback. Mechanical repeatability: ±0.01 mm. Dual Y‑axis synchronous drive eliminates beam skew under high speed. Supports large‑format bipolar plates (300×300 mm to 800×500 mm) for complex flow‑channel sealing paths, enabling high‑speed, smooth continuous dispensing.


2. Intelligent Glue Supply & Metering System

●Selects screw, piston or jet valve based on viscosity – suitable for low‑to‑medium (500–100k cps) or high viscosity (100k–500k cps) silicone, epoxy, UV adhesives.

●Closed‑loop pressure and flow feedback ensures bead width (0.3–2.0 mm) and thickness (0.05–0.3 mm) variation ≤ ±5 % or absolute deviation ≤ ±0.02 mm (whichever is greater).


3. Vision Positioning & Compensation Module

High‑resolution CCD camera detects plate fiducials and flow‑channel edges, automatically correcting positional deviations. Optional laser sensor monitors plate warpage in real time and dynamically adjusts dispensing height.


4. Bead Quality Inspection System

In‑line laser profilometer or 2D/3D camera inspects bead width, missing glue, overflow, etc., and triggers MES‑linked alarms.


5. Curing Unit (optional)

●UV adhesive: follow‑type UV‑LED curing head for immediate post‑dispensing cure without interfering with motion.

●Thermoset/epoxy: separate hot‑air or infrared curing station to avoid thermal distortion or contamination at dispensing station.



Typical Process Applications


1. Bipolar Plate Sealing – Applies O‑ring or rectangular sealing beads to anode/cathode sides of metal or graphite plates, creating gas‑tight isolation after compression.


2. MEA Frame Bonding – Precisely bonds MEA to sub‑gasket frames (PEN, PI, etc.) and fills edge gaps.


3. Micro‑Hole Filling (rework) – Localized glue fill for leakage points or joint gaps. Recommended offline rework station with high‑magnification vision and micro‑jet valve; not integrated into production lines.



Typical Application Scenarios


1. High‑Volume Production (automotive, stationary power)

For standard plates with total bead length ≤ 800 mm: throughput 120–240 plates/hour, with auto load/unload and stacking, suitable for automotive stacks and MW‑scale stationary stacks. (Bead length > 1200 mm reduces throughput to 60–100 plates/hour.)


2. Special & Portable Fuel Cells (drones, soldier power, chargers, etc.)

Optional micro‑bead module (width ≥ 0.1 mm) for small‑size, high‑precision sealing and frame bonding.


3. PEM Electrolyzer for Hydrogen Production

Sealing for electrolyzer plates and MEA. Optional high‑potential‑resistant adhesives and UV quick‑curing unit to prevent electrolyte cross‑leakage and improve efficiency.


4. R&D & Pilot Production

Universities, institutes, R&D centers – validation of new materials (graphite composite, ultra‑thin metal), bead compression testing, process window exploration.


5. Repair & Re‑gluing

Offline workstation for precise re‑gluing of local leakage points, micro‑holes or frame debonding, extending stack life.


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