The R&D-type high-precision TCB thermocompression bonder is designed for advanced semiconductor packaging, microelectronic devices, and new packaging process development.
It supports C2C and C2S thermocompression bonding, including precise alignment, contact, heating, pressure application, holding, and controlled cooling.
The equipment integrates a high-precision X/Y/θ stage, microscopic vision alignment, precision Z-axis bonding, closed-loop force control, and independent upper/lower temperature control, enabling coordinated control of temperature, pressure, displacement, time, and alignment position.
It also supports quick changeover of bonding heads, nozzles, carriers, and fixtures, with recipe management, process curve recording, and data traceability for process window development.
PRODUCT DESCRIPTION
● Flip-Chip thermocompression bonding
● C2C / C2S advanced packaging and micro-assembly
● Thermocompression bonding of microbumps and solder bumps
● R&D of bonding processes such as Au-Au / Cu-Cu
● Precision assembly of MEMS, optoelectronic devices, sensors, and power devices
● Process development for new materials and new structures and small-batch sample validation
1. High-Precision Vision Alignment
Uses a microscopic vision system and a precision X/Y/θ motion stage to perform Mark recognition on chips and substrates, position deviation calculation, and micron-level position correction, meeting the precision alignment requirements of advanced packaging R&D.
2. Precision Closed-Loop Force Control
Equipped with a high-precision force sensor and a precision Z-axis actuator, it supports multi-stage processes such as contact detection, pre-pressing, main pressing, pressure holding, and gradual pressure release, and can record process curves such as force-time and displacement-time.
3. Independent Upper/Lower Temperature Control
The bonding head and substrate stage can each perform closed-loop temperature control, supporting programmed heating, constant-temperature bonding, and controlled cooling, enabling coordinated operation of temperature and pressure profiles.
4. Flexible R&D Configuration
Supports different bonding heads, nozzles, carriers, fixtures, and force sensor configurations, and can be customized according to chip size, material system, bonding force, and temperature requirements, facilitating various process validations.
5. Traceable Process Data
Supports process recipe management and can record information such as temperature, force, displacement, time, alignment coordinates, alarms, and batch numbers, providing a data basis for process optimization, repeatability analysis, and R&D validation.
The equipment mainly consists of a high-rigidity precision frame, an X/Y/θ precision motion stage, a Z-axis bonding actuator, a microscopic vision alignment system, upper/lower heating and temperature control systems, a vacuum adsorption and gas circuit system, an industrial control system, and a safety protection system.
All systems are coordinated through a motion controller, industrial PC, and control software to achieve integrated operation of vision alignment, precision motion, temperature control, and bonding force control.
| Item | Reference Parameters |
| Chip placement/bonding position accuracy | ±2 μm (recommended target) |
| Motion stage repeat positioning accuracy | ≤1 μm (reference) |
| X/Y effective stroke | ≥100 × 100 mm, customizable |
| θ adjustment range | ≥±5° |
| Z-axis effective stroke | ≥10 mm |
| Z-axis displacement resolution | ≤0.5 μm |
| Bonding force range | 1–500 N, configurable according to process |
| Force control accuracy | ±1% F.S. |
| Bonding head temperature | Room temperature–450 °C |
| Substrate stage temperature | Room temperature–350 °C |
| Temperature control stability | ±1 °C (reference) |
| Bonding head heating rate | ≥30 °C/s (rapid heating configuration) |
| Bonding head cooling rate | ≥20 °C/s (enhanced cooling configuration) |
| Chip size | Approx. 1 × 1–50 × 50 mm |
| Substrate size | Max. approx. 200 × 200 mm |
| High-precision effective bonding area | ≥100 × 100 mm, customizable |
Note: The above parameters are recommended configuration ranges for the R&D-type high-precision TCB thermocompression bonder. Actual configuration and performance specifications depend on chip size, substrate structure, Mark quality, bonding material, temperature, bonding force, and process flow, and are subject to the project technical agreement.
According to different advanced packaging R&D requirements, functions such as automatic vision alignment, active parallelism compensation, protective atmosphere, rapid heating/cooling, workpiece temperature measurement, multi-range force sensors, bonding heads of different specifications, and vacuum adsorption fixtures can be added.
The equipment can be customized for different process routes such as Flip-Chip, microbumps, Au-Au, and Cu-Cu, providing a flexible thermocompression bonding platform for advanced packaging material research, process window development, sample validation, and small-batch R&D production.
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