The Vacuum Diffusion Bonding Machine by Shuntian Equipment is a high-end system engineered for critical applications such as aerospace superalloys, titanium alloy structures, laminated composites, nuclear fuel elements, and microelectronic packaging.
Designed to deliver precise control over temperature, pressure, time, and vacuum levels—either in vacuum or atmosphere environments—it empowers customers to scale seamlessly from R&D to full-scale production.
PRODUCT DESCRIPTION
1. Ultra-High Vacuum for Atomically Clean Bonding
A three-stage pumping system (molecular pump + Roots pump + mechanical pump) and full-metal-sealed chamber achieve an ultimate vacuum of ≤5×10⁻⁴ Pa (higher options available). This removes surface oxides and adsorbed gases, preventing re-oxidation at high temperatures—ideal for reactive metals like titanium and zirconium alloys.
2. Multi-Zone Heating with Exceptional Uniformity
Heaters (graphite, molybdenum, or nickel-chromium strips) are independently controlled in multiple axial/radial zones, with dual thermocouple and infrared feedback. Temperature uniformity across the working zone is held within ±3°C to ±5°C, ensuring consistent grain structure in large or complex parts and eliminating incomplete bonding or grain coarsening.
3. Precision Servo Pressurization with Micron-Level Control
Closed-loop servo-hydraulic or electric actuators, paired with high-resolution displacement sensors, deliver real‑time compression monitoring. Pressure accuracy is ±0.5% FS, and displacement resolution reaches 0.1 μm—critical for multilayer foils, micro‑channel structures, and bond‑line tolerance control.
4. Rapid Gas Quenching for Microstructure Optimization
An integrated internal/external gas quenching system (argon/nitrogen) with a high‑efficiency heat exchanger enables fast cooling after the soak. This refines grain size, improves joint properties, and cuts cycle times, boosting overall equipment productivity.
5. Integrated Process Database with Full Traceability
The intelligent control system includes an expert database for common material pairs (e.g., Ti/Al, Ti/stainless steel, superalloys). All process parameters—temperature, pressure, vacuum, displacement—are recorded in real time, supporting AS9100 and Nadcap compliance with tamper‑proof electronic records for each bond.
●Aerospace: Hollow fan blades, blisks (titanium/superalloys); multi‑layer honeycomb panels, heat exchangers; SPF/DB titanium structures
●Electronics & Semiconductors: High‑power chip/substrate packaging (Cu/Al₂O₃, Cu/DBC); wafer‑level MEMS vacuum packaging
●Medical Devices: Dissimilar metal implants (Ti/stainless steel); precision instrument joining
●Advanced Materials R&D: Layered metal composites (Ti/steel, Al/Cu, Ni/Al); metal matrix composites; refractory metal bonding
CUSTOMIZED PRODUCTS
Custom equipment manufacturing: end-to-end solutions for your needs, empowering core competitiveness.
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